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Brand new eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils eMCP162 eMCP186 eMMC153 eMMC169

Brand new eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils eMCP162 eMCP186 eMMC153 eMMC169

Brand new eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils eMCP162 eMCP186 eMMC153 eMMC169

Product Details:

Place of Origin: CN
Brand Name: vipprog
Certification: CE
Model Number: VC212

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: 5
Delivery Time: 2-3days
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 100000
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Detailed Product Description
Name: EMMC/eMCP Reballing Stencil Kit 4 In 1 BGA ReBalling Stencils

4 in 1 BGA ReBalling Stencils for eMMC153 / eMMC169 / eMCP162 / eMCP186, eMMC/eMCP Reballin Template Stencil for BGA Rework Station, 4 in 1 bga reballing kit and eMMC / eMCP plant Stencil.



eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils


4 in 1 design bga reballing kit, capable apply to eMMC153/eMMC169, eMCP162 /eMCP186 nand flash IC reballing at the same time
Moldcore designs with dismountable, easy to change through two screws, change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing
Moldcore uses high accuracy IC Grinding Machine, accurate IC location

 

Contact Details
vipprogrammer

Contact Person: Mr. yong

Tel: 86--15986801289

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