|Place of Origin:||CN|
|Minimum Order Quantity:||1|
|Payment Terms:||L/C, D/A, D/P, T/T, Western Union, MoneyGram|
|Name:||WL Intelligent IPhone Grinding Equipment Smart|
WL Intelligent Grinding Machine is the professional iPhone IC Chip Grinding Machine, and used to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 4, 4S, 5, 5C, 5S, 6 and 6 plus. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing.
WL Smart Grinding Equipment for iPhone IC Repair, with Touch Screen, Don't need computer
High lights for Smart iphone Grinding Machine:
1. With this machine, you can remove IC easily. Just insert SD card and press "Run", then the machine can remove IC automatically;
2. With LED Light, Camera and TFT Monitor, you can watch the whole engraving procedure clearly;
3. With Vacuum Cleaner, you are free from the troubles of dust during working;
4. With Smart Computer, you can program easily for a new chip, and don't need external computer; In the future, we can also send you the new data for new chips;
5. With Pressure Sensor, the machine can adjust the engraving depth automatically. It can avoid damaging main board if curving;
6. We will update molds while new cell phone comes out.
Optional 1: Full Set Smart IC Grinding Machine, without Optional 2 +3
Optional 2: Added Vacuum Cleaner
Optional 3: Added Microscope
Optional 4: Added Optional 2+ Optional 3
1. No need programming,entered already.
2. Do not need computer.
3. Solves the problem of chip’s tilt angle.
4. Size error polished problem solved, automatically set the size of the chip out of the tool path, support manual settings under the knife depth and coordinates.
5. Smart SD card to store data, a full range of Apple IC home position, the chip grinding parameters have been set already, free update.
6. Monitor tool wear by pressure,
7. Knife pressure spindle overrun, protect board.
8. Y axis pinch hand function.
9. Automatically emergency alarm.
10. eight templates, a full range of Apple's original board IC, unlimited upgrades
11. Automatic cleaning system. ( Optional 2)
12. HD camera ( Optional 3 ), can manually focus, distinguish polished IC level, monitoring add depth.
13. Touch sreen configuration, easy operate
Operating voltage 220v / 110v (need custom-made)
Table size 205 * 245mm
Spindle power 800W
Effective working size 200*200*50mm
Spindle speed 24000rpm
Template size 190 * 230mm
Reading program SD Card (suggest 1 to 16GB)
Chuck Size 1-7mm
If use BGA rework station or desoldering station.
1. BGA chip is difficult to be removed as soder ball melts but glue didn't.
2. uneven heat will damage the surrounding chip and PCB layers, heat especially will melt surrounded BGA chip’s solder point and cause short circuit.
If use IC grinding machine
1. we can engraving the whole chip and show the PCB pads.
2. PCB and chip may have tilt angle, it cause the engraving difficult to just cut a flat area, our smart IC remover has detector to check 4 corners of chip before engraving, we can then calculate the chip’s tilt angle.
3. Work without PC, just control the LCD touch screen we can easy to remove BGA chip.
4. No need to do glue removing.